DYCONEX, an MST company, offers an advanced rigid multilayer substrate material permitting ultra-thin build-ups for various high frequency applications, particularly suitable for HF chip packaging.
The material delivers low dielectric properties (low Dk and low Df) combined with a low thermal expansion coefficient (CTE) and high dielectric strength. Using any layer technology, the substrates layers are only connected by laser drilled, copper filled microvias that allow for high-density/high-reliability designs. Other HDI build-up solutions are also available.
Additional substrate features include:
To learn more about the material characteristics, design features, and layer build-up characteristics, download the brochure.