Assembly Technology
Source: Micro Systems Technologies
In addition to interconnect and semiconductor packaging technologies, MST covers all major board assembly technologies. SMT (Surface Mount Technology) and chip & wire technologies are available for the assembly of components like SMDs, BGAs, LGAs, CSPs, flip chips or bare dies on ceramic and organic substrates.
MST’s capabilities and services include:
- Surface Mount Technology (SMT)
- Flip chip / CSP (Chip Scale Package) capability
- Die attach technologies
- Wire bonding
- Die protection and encapsulation
- Test services
For specifics on what each of those areas entail and how they can help with your next medical device design, download the datasheet.
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Micro Systems Technologies
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