Product/Service

Assembly Technology

Source: Micro Systems Technologies

Assembly Technology

In addition to interconnect and semiconductor packaging technologies, MST covers all major board assembly technologies. SMT (Surface Mount Technology) and chip & wire technologies are available for the assembly of components like SMDs, BGAs, LGAs, CSPs, flip chips or bare dies on ceramic and organic substrates.

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MST’s capabilities and services include:

  • Surface Mount Technology (SMT)
  • Flip chip / CSP (Chip Scale Package) capability
  • Die attach technologies
  • Wire bonding
  • Die protection and encapsulation
  • Test services

For specifics on what each of those areas entail and how they can help with your next medical device design, download the datasheet.

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