In addition to interconnect and semiconductor packaging technologies, MST covers all major board assembly technologies. SMT (Surface Mount Technology) and chip & wire technologies are available for the assembly of components like SMDs, BGAs, LGAs, CSPs, flip chips or bare dies on ceramic and organic substrates.
MST’s capabilities and services include:
For specifics on what each of those areas entail and how they can help with your next medical device design, download the datasheet.