Assembly Technology

Assembly Technology

In addition to interconnect and semiconductor packaging technologies, MST covers all major board assembly technologies. SMT (Surface Mount Technology) and chip & wire technologies are available for the assembly of components like SMDs, BGAs, LGAs, CSPs, flip chips or bare dies on ceramic and organic substrates.

MST’s capabilities and services include:

  • Surface Mount Technology (SMT)
  • Flip chip / CSP (Chip Scale Package) capability
  • Die attach technologies
  • Wire bonding
  • Die protection and encapsulation
  • Test services

For specifics on what each of those areas entail and how they can help with your next medical device design, download the datasheet.

Need More Information? Just Ask.

Click the button below to directly contact the supplier. Use it to:

  • Ask a question.
  • Request more detailed information or literature.
  • Discuss your current project/application.
  • Request a quote.
  • Locate a distributor in your area.
  • Schedule a demo.
Request Information