Newsletter | March 16, 2020

03.16.20 -- Infrared's Impact On Manufacturing, Microsopy, And More

 
Shortwave Infrared Cameras For High-Temperature Manufacturing And R&D Processes
 
Shortwave infrared (SWIR) cameras are sensitive to shorter IR wavelengths between visible light and 3 µm. They've historically been used for qualitative imaging applications like laser beam profiling, silicon wafer inspection, and imaging through layers of paint and ink. Now, with the addition of temperature measurement capabilities, SWIR cameras offer a win-win for anyone concerned with thermal analysis of high-temperature materials or processes.
Infrared Camera Accuracy And Uncertainty In Plain Language
 
Trusting measurements from instruments can be difficult without a clear understanding of how the sensitivity and accuracy is derived. Many times, infrared camera measurement accuracy is confusing and can involve complex terms and jargon that may be misleading.
Temperature Guns Versus Thermal Imaging Technology
 
Common tools for noncontact temperature measurements include both thermal imaging cameras and spot pyrometers. Each works by detecting infrared radiation and translating it into temperature readings. Thermal cameras, however, have several advantages compared to spot pyrometers, including image generation, temperature readings of each pixel of the entire image, and temperature readings from a longer distance.
Ultra-High-Speed Thermography
 
Recent advances in IR camera technologies, such as fast camera detector readouts and high-performance electronics, allow high-speed imagery. This article is part five of a handbook that discusses the use of ultra-high-speed thermography with IR cameras.
Infrared Microscopy — How To Get Accurate Temperature Measurements And Find Hot Spots Using The Proper Infrared Camera Lenses
 

Finding and fixing hot spots within ever-shrinking electronic systems has become more and more difficult. This webinar examines close-up and microscopic lenses and how they allow infrared cameras to make accurate temperature measurements on components less than 25 µm in size and image targets as small as 3.5 µm.