Semiconductor Technology
Source: Micro Systems Technologies
All mission critical functions are accessible within the MST group to provide miniaturized packages. Capabilities include design, substrate manufacturing, component selection, and validation as well as all major semiconductor packaging processes.
Customized packaging solutions are available for a wide range of base materials, I/O configurations and housing types. The newest technology development enables the production of SDBGAs (Stacked Die Ball Grid Arrays) in small and medium-sized volumes applying transfer molding technology, laser marking and singulation.
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