Brochure | January 25, 2018

Advanced Rigid Substrates For HF Applications, Ultra-Thin Build-Ups And Chip Packages Brochure

Source: Micro Systems Technologies

DYCONEX, an MST company, offers an advanced rigid multilayer substrate material permitting ultra-thin build-ups for various high frequency applications, particularly suitable for HF chip packaging. The material delivers low dielectric properties (low Dk and low Df) combined with a low thermal expansion coefficient (CTE) and high dielectric strength. Using any layer technology, the substrates layers are only connected by laser drilled, copper filled microvias that allow for high-density/high-reliability designs. To learn more about the material characteristics, design features, and layer build-up characteristics, download the brochure.

VIEW THE BROCHURE!
Signing up provides unlimited access to:
Signing up provides unlimited access to:
  • Trend and Leadership Articles
  • Case Studies
  • Extensive Product Database
  • Premium Content
HELLO. PLEASE LOG IN. X

Not yet a member of Med Device Online? Register today.

ACCOUNT SIGN UP X
Please fill in your account details
Login Information
I'm interested in newsletter subscriptions.
ACCOUNT SIGN UP

Subscriptions

Sign up for the newsletter that brings you the industry's latest news, technologies, trends and products.

You might also want to: