BGA Flux
Source: EFD, Inc.
Developed to attach high-density packages in ball grid array and flip-chip applications, a BGA paste flux is suited for pitches to 10 mil
Developed to attach high-density packages in ball grid array and flip-chip applications, a BGA paste flux is suited for pitches to 10 mil. Offering 48 hours of tack, the paste flux provides wetting for common substrate finishes including Ni-Au, HASL, and OSP. Available for eutectic and high-temperature soldering applications, the paste is offered in no clean, RMA, and water-soluble versions in either red or yellow.
EFD, 977 Waterman Avenue, East Providence, RI 02914-1378
Fax: 401-431-0237.
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