Biocompatible Flexible Substrates For Directly Implantable Applications
Source: Micro Systems Technologies
Dyconex, an MST company, offers an array of biocompatible flexible substrates that are ideal for short term and long term direct implant applications such as diagnostics, neurostimulation, implantable electrodes, catheters, sensors, and actors. These substrates combine biocompatible structures and conventional PCB technology, and are composed of dielectric base materials such as LCP, PI, or glass.
The flexible substrates feature thin film noble metal traces and large manufacturing panels, and operate with the highest resolutions for miniaturized interconnects.
Additional features include:
- Electrodes can be recessed or raised to the polymer surface
- Minimum substrate thickness: 50 μm
- Glue-free buildup with LCP base material
- Tape test in accordance with IPC-TM-650 2.4.1 and bending test to verify thin film adhesion
- Final cleaning operations to ensure biocompatibility
Download the datasheet for more features, specifications, and diagrams on the makeup of these biocompatible flexible substrates.
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