Dispensing Solder Paste
Source: EFD, Inc.
Ultra Fine Pitch dispensing solder paste is formulated for trouble-free application with auger or positive displacement valves in surface-mount assembly operations
Ultra Fine Pitch dispensing solder paste is formulated for trouble-free application with auger or positive displacement valves in surface-mount assembly operations. The paste can be dispensed through tips as fine as 30 gage without clogs or separation, which makes it possible to assemble 16-mil pitch circuit board assemblies with automatic dispensing equipment. Its clog-free formulation provides up to 10,000 shots/hour, for a workflow rate compatible with most pick-and-place machines. The paste is packaged in 10-g syringes. The packaging process prevents entrapped air that can cause skipping problems. A single 3-cc syringe will furnish up to 100,000 deposits without clogging or separation. The paste is available in several alloys. Flux options include RMA, water Soluble and No Clean Low Residue.
EFD, 977 Waterman Ave., East Providence, RI 02914. Phone: 401-434-1680; Fax: 401-431-0237.
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