Epoxy Resin System
Source: Master Bond Inc.
EP51AO is a two component, ceramic-filled, thermally-conductive, electrically-insulative epoxy resin compound designed for heat dissipative bonding, sealing and potting assemblies
Master Bond Inc. two component, ceramic-filled, thermally-conductive, electrically-insulative epoxy resin compound designed for heat dissipative bonding, sealing and potting assemblies. The compound is formulated to cure readily at ambient temperatures with a one-to-one mix ratio, weight or volume. After mixing, the compound gels in as little as five minutes and cures fully within two hours at ambient temperatures. The cured epoxy resin compound exhibits high physical strength properties together with a thermal conductivity of 8 Btu/hr/ft2/°F/in at 75°F. It is a good electrical insulator with an electrical volume resistivity in excess of 1012 ohm cm.
<%=company%>, 154 Hobart ST., Hackensack, NJ 07601. Phone: 201-343-8983; Fax: 201-343-2132.