HermeS® Hermetic Through Glass Via (TGV) Wafer Datasheet
Source: SCHOTT North America, Inc.
The HermeS® Hermetic Through Glass Via (TGV) Wafer is a glass substrate designed to enable fully gastight and long-term robust enclosures for MEMS devices such as industrial hermetic MEMS sensors, medical MEMS, and RF MEMS. It features vine-pitched vias that allow for reliable conduction of electrical signals and power into and out of MEMS devices. For additional information on the HermeS® glass wafer, download the datasheet.
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