Datasheet | October 16, 2013

Microassembly For Miniaturized Electronics Datasheet

Source: Cicor Microelectronics

Challenges for medical applications
Challenges for medical applications Microassembly work in electronic medical technology requires a high level of expertise and experience. Due to the systems‘ complexity and the small size of the components involved, the demands placed on manufacturing technologies are unusually high.

  • Highly complex systems
  • Miniaturisation, extremely small components
  • Reliability and functionality
  • High technical requirements
  • Biocompatibility (implant, contact with human tissue)

Cicor Microelectronics solution

  • Sophisticated assembly and packaging technologies
  • Assembly of ceramic, foils and other flexible boards, including microoptical elements and with up to 01005 components 
  • Miniaturised systems (substrates less than 0.02 mm thick)
  • Use of biocompatible materials such as titanium, gold and platinum
  • Ultra-fine flip chip assembly
  • Wire bonding
  • Stable production processes

Cicor Microelectronics services

  • One-stop shop from development to the finished electronics module
  • Development service adapted to suit your requirements
  • Development service for the manufacture and integration of medical microsystems
  • Procurement of components or complete management of materials purchasing
  • Production process for prototypes and serial production
  • Fast prototyping
  • Guaranteed traceability
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