Molded Interconnect Device/Laser Direct Structuring (MID/LDS) Brochure
Source: Molex
Molex’s Molded Interconnect Device/Laser Direct Structuring (MID/LDS) capabilities can be used to integrate electrical and mechanical features like 3D circuitry or shielding technology onto medical devices. Download the brochure for more information.
access the Brochure!
Log In
Get unlimited access to:
Trend and Thought Leadership Articles
Case Studies & White Papers
Extensive Product Database
Members-Only Premium Content
Welcome Back! Please Log In to Continue.
X
Enter your credentials below to log in. Not yet a member of Med Device Online? Subscribe today.
Subscribe to Med Device Online
X
Subscribe to Med Device Online
This website uses cookies to ensure you get the best experience on our website. Learn more