Product/Service

RTX-113HV X-ray inspection system

Source: Glenbrook Technologies, Inc.
A powerful real-time X-ray inspection system, designed specifically for rapid, reliable inspection of both multi-layer and assembled printed circuit boards with dense metal BGAs
Our RTX-113HV system meets all your needs for inspecting BGA packages, including many recently introduced BGAs that contain dense metal heat sinks that require a higher voltage X-ray source to clearly identify and troubleshoot production faults. In response to the introduction of these newer BGA packages Glenbrook has developed the new "HV" with a stronger 70kV X-ray tube that permits quality inspection of these denser metal components. The remodeled cabinet design permits easy integration into even the busiest production environments, and is totally upgradable with many of the options listed to the right.

Applications:

  • Multi-layer PCBs
  • Small Hole Drilling
  • Dense Metal BGA Inspection
  • Backplane Boards
Specifications:
  • 50"H x 60"W x 33"D
  • Operating Voltage: 120v/220v, 50-60hz
  • Contrast Resolution: Can resolve .001 gold wire
  • Spatial Resolution: 20lp/mm
    (with MicroTechTM option, up to 100lp/mm)
  • Anode Voltage: 70kV
  • Anode Current: 100 microamps (internal adjustment)
  • Focal Spot Size: 0.2mm
  • Focal Spot to Image Plane Distance: 4-6 inches
  • X-ray Activation Mode: foot pedal or timer switch
Options:
  • Image Processing/Advanced transfer capabilities
  • Video Printer
  • XRTV Zoom Camera (4X-50X magnification)
  • Micro-TechTM 10-micron X-ray Source (225X)
  • BGA and Void Measurement software
  • Manual/Motorized X-Y positioner

Glenbrook Technologies, Inc., 11 Emery Avenue, Randolph, NJ 07869. Tel: 973-361-8866; Fax: 973-361-9286.